RFP22N10 |
RFQ for RFP22N10 |
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| Technical/Catalog Information | RFP22N10 |
| Vendor | Fairchild Semiconductor |
| Category | Discrete Semiconductor Products |
| Mounting Type | Through Hole |
| FET Polarity | N-Channel |
| Drain to Source Voltage (Vdss) | 100V |
| Current - Continuous Drain (Id) @ 25° C | 22A |
| Rds On (Max) @ Id, Vgs | 80 mOhm @ 22A, 10V |
| Input Capacitance (Ciss) @ Vds | - |
| Power - Max | 100W |
| Packaging | Tube |
| Gate Charge (Qg) @ Vgs | 150nC @ 20V |
| Package / Case | TO-220AB |
| FET Feature | Standard |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | RFP22N10 RFP22N10 |
| Product | Manufacturers | Pack | D/C |
| RFP22N10 | - | TO-220 | 06+ |
These N-Channel power MOSFETs are manufactured using the MegaFET process. This process, which uses feature sizes approaching those of LSI integrated circuits gives optimum utilization of silicon, resulting in outstanding performance. They were designed for use in applications such as switching regulators, switching converters, motor drivers, and relay drivers. These transistors can be operated directly from integrated circuits.
Formerly developmental type TA9845.
Features |
| • 22A, 100V• rDS(ON) = 0.080W• UIS SOA Rating Curve (Single Pulse)• SOA is Power Dissipation Limited• Nanosecond Switching Speeds• Linear Transfer Characteristics• High Input Impedance• 175oC Operating Temperature• Related Literature - TB334 "Guidelines for Soldering Surface Mount Components to PC Boards" |
| Drain to Source Voltage (Note 1) | VDSS | 100 | V |
| Drain to Gate Voltage (RGS = 20kW)(Note 1) | VDGR | 100 | V |
| Gate to Source Voltage | VGS | ±20 | V |
| Continuous Drain Current | ID | 22 | A |
| Pulsed Drain Current | IDM | 50 | A |
| Maximum Power Dissipation | PD | 100 |
W |
| Linear Derating Factor | 0.67 | W/ | |
| Operating and Storage Temperature | TJ , TSTG | -55 to175 | |
| Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s. Package Body for 10s, See Techbrief 334 |
T L Tpkg |
300 260 |
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
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